Electronics Assembly Quality Engineer

You will review electronics assembly and component validation cases to help create accurate training data for AI systems. The work combines solder joint analysis, reflow process review, quality decisions, and counterfeit component screening.

You may focus on BGA joint X-ray review, counterfeit component screening, or both.

• Analyze X-ray images of BGA, CGA, and LGA solder joints.
• Identify voiding, head-in-pillow defects, bridging, open joints, and related anomalies.
• Review reflow soldering profiles and recommend process adjustments.
• Develop root cause analyses for solder joint failures and reliability concerns.
• Assess cases against IPC Class 3 acceptance criteria and document your reasoning.
• Evaluate laboratory workflows and test methods for counterfeit electronic components.
• Prepare clear written and verbal summaries of technical findings.

This is a remote, part-time contractor opportunity open across the listed countries.

• Language: Professional fluency in English.
• Required: Experience in electronics manufacturing process engineering, quality engineering, or laboratory analysis.
• Required: Advanced ability to interpret X-ray images of area-array packages and diagnose solder joint failures.
• Required: Strong knowledge of reflow soldering optimization and process troubleshooting.
• Required: Familiarity with IPC acceptance standards, especially IPC Class 3 requirements.
• Useful: Experience with counterfeit component detection and component authentication laboratory practices.
• Useful: Experience with IPC-7095, IPC-A-610 Class 3, visual inspection, marking permanency testing, XRF, decapsulation, or X-ray-based counterfeit screening.
• Prior AI experience is not required.