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Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging

Published Sep 1, 2018
arXiv PDF
Researcher verdict
Starting point
Use as implementation starting point
Benchmark evidence
Missing
Not verified yet
Time to first repro
A few days
Plan setup time
Risk flags
1
Review before use

Results and benchmarks

Freshness tier: cold
Coupled Simulation of Transient Heat Flow and Electric Currents in Thin Wires: Application to Bond Wires in Microelectronic Chip Packaging focuses on scientific computing.

Implementation

Historical official implementation (not recommended for new builds)

Why this implementation
Confidence: medium

brayonpi/hexstellar is the closest maintained adjacent implementation (Matches contextual method/domain keyword: scientific computing). It is not paper-verified; validate algorithm and evaluation setup against the paper before trusting reported metrics. Community adoption signal: 1428 GitHub stars.

Open tc88/ETwireSim
Reproduction risks
  • Adjacent implementations are not paper-verified
  • Recommended repository is adjacent and not paper-verified.
  • No direct maintained implementation is currently verified.
  • Only historical official repository was found: tc88/ETwireSim.
  • No maintained paper-verified implementation met reliability thresholds.

Compare implementation paths

Compare maintenance quality, reproducibility coverage, and evidence confidence before choosing a reproduction baseline.

tc88/ETwireSim
historical official
Maintenance
Stale
Confidence
High
Reproducibility
Limited
Stars
3
Last push
Sep 25, 2018 (2957d)

Official implementation from Papers with Code · Repository link is mentioned in the paper metadata

  • No push in 12+ months
  • No CI pipeline detected
  • No tagged releases
temf/ETwireSim
alternative
Maintenance
Stale
Confidence
Medium
Reproducibility
Limited
Stars
0
Last push
Sep 25, 2018 (2957d)

Official implementation from Papers with Code · Repository appears stale (>24 months since last push)

  • No push in 12+ months
  • No CI pipeline detected
  • No tagged releases

Reproduction readiness

Time to first repro: days
Last checked: Oct 27, 2026

Major work

No dependency manifest, manual reconstruction required

  • tc88/ETwireSim has no requirements.txt, environment.yml, pyproject.toml, or Dockerfile.
  • You will need to reverse-engineer dependencies from import statements in the source code.
  • Last push was 2957 days ago.
Open tc88/ETwireSim

Hardware requirements

  • Expect multi-day setup/compute for meaningful reproduction based on current guidance.

Repositories and ecosystem

Closest related implementations

These are not paper-verified. Use them as reference points when no direct implementation is available.

  • brayonpi/hexstellar Adjacent · Confidence: Medium · 1,428 stars

    Matches contextual method/domain keyword: scientific computing

Official

  • temf/ETwireSim
    Confidence: Medium

    Efficient Thin Wire Simulator for 3D Electrothermal Problems

    0 stars · 0 forks · Last push Sep 25, 2018 · GPL-3.0 license

Community

No additional community repositories detected yet.

Hugging Face artifacts

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Research context

Tasks

Scientific computing

Methods

None detected

Domains

None detected

Evaluation and human feedback data

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Scientific computing

Data includes links from Papers with Code ( CC-BY-SA-4.0 ).