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C
Chun Y.

Chun Y.

Senior Engineer in Electroplating, TSV/ TGV filling, EDA software

China flagHong Kong, China

Key Skills

Software

No software listed

Top Subject Matter

Electroplating EDA software engineer
TSV/ TGV electroplating
Laboratory management

Top Data Types

Computer Code ProgrammingComputer Code Programming
TextText
DocumentDocument

Top Task Types

No task types listed

Freelancer Overview

Senior Engineer in Contract Review, Compliance, and Legal Research. Brings 12+ years of professional experience across legal operations, contract review, compliance, and structured analysis. Education includes Bachelor of Science, Hong Kong University of Science and Technology (2017). Well suited for text-focused AI training, including legal document review, compliance annotation, and rubric-based quality evaluation.

Education

H

Hong Kong University of Science and Technology

Bachelor of Science, Chemistry

Bachelor of Science
2016 - 2017

Work History

H

Hong Kong Applied Science and Technology Research Institute

Senior Engineer

Hong Kong
2022 - Present
H

Hong Kong Applied Science and Technology Research Institute

Engineer

Hong Kong
2019 - 2022